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INTEGRATED CIRCUITS
DATA SHEET
PCD3349A 8-bit microcontroller with DTMF generator
Product specification Supersedes data of 1996 Dec 18 File under Integrated Circuits, IC03 1998 May 11
Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
CONTENTS 1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.5 7 8 9 10 11 12 13 14 15 16 17 18 18.1 18.2 18.3 19 20 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description FREQUENCY GENERATOR Frequency generator derivative registers Frequency registers DTMF frequencies Modem frequencies Musical scale frequencies TIMING RESET STOP MODE IDLE MODE INSTRUCTION SET SUMMARY OF MASK OPTIONS LIMITING VALUES HANDLING DC CHARACTERISTICS AC CHARACTERISTICS PACKAGE OUTLINES SOLDERING Introduction DIP SO DEFINITIONS LIFE SUPPORT APPLICATIONS
PCD3349A
1998 May 11
2
Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
1 FEATURES 2 GENERAL DESCRIPTION
PCD3349A
* 8-bit CPU, ROM, RAM, I/O in a single 28-lead package * 4-kbyte ROM * 224-byte RAM * Over 100 instructions (based on MAB8048) all of 1 or 2 cycles * 20 quasi-bidirectional I/O port lines * 8-bit programmable Timer/event counter 1 * 2 single-level vectored interrupts: - external - Timer/event counter 1 * Two test inputs, one of which also serves as the external interrupt input * DTMF tone generator * Reference for supply and temperature-independent TONE output * Filtering for low output distortion (CEPT compatible) * Power-on-reset * Stop and Idle modes * Supply voltage: 1.8 to 6 V (DTMF TONE output from 2.5 V) * Low standby voltage of 1 V * Low Stop mode current of 1 A (typical) * Clock frequency: 1 to 16 MHz (3.58 MHz for DTMF suggested) * Manufactured in silicon gate CMOS process. 3 ORDERING INFORMATION
The PCD3349A provides 4 kbytes of Program Memory, 224 bytes of RAM and 20 I/O lines. The PCD3349A is a microcontroller which has been designed primarily for telecom applications. It includes an on-chip dual tone multi-frequency (DTMF) generator. The instruction set is based on that of the MAB8048 and is software compatible with the PCD33xxA family. This data sheet details the specific properties of the PCD3349A. The shared characteristics of the PCD33xxA family of microcontrollers are described in the "PCD33xxA Family" data sheet and also in "Data Handbook IC03; Section PCD33xxA Family", which should be read in conjunction with this publication.
PACKAGE TYPE NUMBER NAME PCD3349AP PCD3349AT DIP28 SO28 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) plastic small outline package; 28 leads; body width 7.5 mm VERSION SOT117-1 SOT136-1
1998 May 11
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TONE PORT 2 FLIP-FLOP FILTER SINE WAVE GENERATOR 8 HGF REGISTER 8 LGF REGISTER 4 8 8 8 INTERNAL CLOCK FREQUENCY 30 32 8 8 8
4
Philips Semiconductors
8-bit microcontroller with DTMF generator
BLOCK DIAGRAM
P2.0 to P2.3 4 PORT 2 BUFFER PORT 1 FLIP-FLOP
P1.0 to P1.7 RESIDENT ROM 8 4 kbytes PORT 1 BUFFER
P0.0 to P0.7 8 PORT 0 BUFFER PORT 0 FLIP-FLOP DECODE
MEMORY BANK FLIP-FLOPS
PCD3349A
HIGHER PROGRAM COUNTER
LOWER PROGRAM COUNTER
PROGRAM STATUS WORD
5
8
8
8
8
8
8
8
8
8
8 MULTIPLEXER
IDLE
CE / T0 INTERRUPT
RESET INITIALIZE
XTAL 1
handbook, full pagewidth
4
T1
TIMER/ EVENT COUNTER
TEMPORARY REGISTER 1 INTERRUPT LOGIC ACCUMULATOR INSTRUCTION REGISTER & DECODER RAM ADDRESS REGISTER ARITHMETIC
timer interrupt
TEMPORARY REGISTER 2
LOGIC UNIT POWER-ON-RESET VPOR external interrupt DECIMAL ADJUST RESET STOP CONTROL & TIMING XTAL 2
CE / T0 T1 CONDITIONAL BRANCH LOGIC TIMER FLAG CARRY ACC ACC BIT TEST
D E C O D E
REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 8 LEVEL STACK (VARIABLE LENGTH) OPTIONAL SECOND REGISTER BANK
DATA STORE
RESIDENT RAM ARRAY 224 bytes
Product specification
PCD3349A
OSCILLATOR
MBG098
Fig.1 Block diagram.
Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
5 5.1 PINNING INFORMATION Pinning 5.2 Pin description
PCD3349A
Table 1
SOT117-1 and SOT136-1 packages PIN DESCRIPTION
SYMBOL
handbook, halfpage
P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 T1 XTAL1
1 2 3 4 5 6 7
28 P0.0 27 P2.3 26 P2.2 25 P2.1 24 VDD 23 TONE 22 VSS 21 P2.0 20 P1.7 19 P1.6 18 P1.5 17 P1.4 16 P1.3 15 P1.2
MBG087
P0.0 to P0.7 28, 1 to 7 Port 0: 8 quasi-bidirectional I/O lines T1 XTAL1 XTAL2 RESET CE/T0 P1.0 to P1.7 P2.0 to P2.3 VSS TONE VDD 8 9 10 11 12 13 to 20 21, 25, 26, 27 22 23 24 Test 1 or count input of 8-bit Timer/event counter 1 crystal oscillator or external clock input crystal oscillator output reset input Chip Enable or Test 0 Port 1: 8 quasi-bidirectional I/O lines Port 2: 4 quasi-bidirectional I/O lines ground DTMF output positive supply voltage
PCD3349A
8 9
XTAL2 10 RESET 11 CE/T0 12 P1.0 13 P1.1 14
Fig.2 Pin configuration (SOT117-1 and SOT136-1).
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
6 FREQUENCY GENERATOR
PCD3349A
A versatile frequency generator section is provided (see Fig.3). For normal operation, use a 3.58 MHz quartz crystal or PXE resonator. The frequency generator includes precision circuitry for dual tone multifrequency (DTMF) signals, which is typically used for tone dialling telephone sets. 6.1 Frequency generator derivative registers
The TONE output can alternatively issue twelve modem frequencies for data rates between 300 and 1200 bits/s. In addition to DTMF and modem frequencies, two octaves of musical scale in steps of semitones are available.
Table 2 gives the derivative addresses, mnemonics and access types of the frequency generator derivative registers. The addresses 03H to FFH are not used. Table 2 Addresses of the frequency generator derivative registers REGISTER HGF(1) LGF(2) 7 H7 L7 6 H6 L6 5 H5 L5 4 H4 L4 3 H3 L3 2 H2 L2 1 H1 L1 0 H0 L0
ADDRESS 01H 02H Notes
1. HGF = High Group Frequency; access type W. 2. LGF = Low Group Frequency; access type W.
dbook, full pagewidth
8
HGF REGISTER
DIGITAL SINE WAVE SYNTHESIZER DAC SWITCHEDCAPACITOR BANDGAP VOLTAGE REFERENCE DAC
8 internal bus
SWITCHEDCAPACITOR LOW-PASS FILTER
RC LOW-PASS FILTER
MBG099
TONE
8
LGF REGISTER
DIGITAL SINE WAVE SYNTHESIZER
Fig.3 Block diagram of the frequency generator section.
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
6.2 Frequency registers Table 3
PCD3349A
DTMF standard frequencies and their implementation; value = LGF, HGF contents FREQUENCY (Hz) STANDARD 697 770 852 941 1209 1336 1477 1633 GENERATED 697.90 770.46 850.45 943.23 1206.45 1341.66 1482.21 1638.24 DEVIATION (%) 0.13 0.06 -0.18 0.24 -0.21 0.42 0.35 0.32 (Hz) 0.90 0.46 -1.55 2.23 -2.55 5.66 5.21 5.24
The two frequency registers HGF and LGF define two frequencies. From these, the digital sine synthesizers together with the Digital-to-Analog Converters (DACs) construct two sine waves. Their amplitudes are precisely scaled according to the bandgap voltage reference. This ensures TONE output levels independent of supply voltage and temperature. The amplitude of the Low Group Frequency sine wave is attenuated by 2 dB compared to the amplitude of the High Group Frequency sine wave. The two sine waves are summed and then filtered by an on-chip switched capacitor and RC low-pass filters. These guarantee that all DTMF tones generated fulfil the CEPT recommendations with respect to amplitude, frequency deviation, total harmonic distortion and suppression of unwanted frequency components. The value 00H in a frequency register stops the corresponding digital sine synthesizer. If both frequency registers contain 00H, the whole frequency generator is shut off, resulting in lower power consumption. The frequency of the sine wave generated is dependent upon the decimal value `x' held in the frequency registers (HGF and LGF), and this may be calculated as follows: f xtal f = -------------------------------- ; where 60 x 255. [ 23 ( x + 2 ) ] The frequency limitation given by x 60 is due to the low-pass filters which would attenuate higher frequency sine waves. 6.3 DTMF frequencies
VALUE (HEX) DD C8 B5 A3 7F 72 67 5D Table 4
Dialling symbols, corresponding DTMF frequency pairs and frequency registers content LGF VALUE (HEX) A3 DD DD DD C8 C8 C8 B5 B5 B5 DD C8 B5 A3 A3 A3 HGF VALUE (HEX) 72 7F 72 67 7F 72 67 7F 72 67 5D 5D 5D 5D 7F 67
TELEPHONE DTMF FREQ. KEYBOARD PAIRS SYMBOLS (Hz) 0 1 2 3 4 5 6 7 8 9 A B C D * # (941, 1336) (697, 1209) (697, 1336) (697, 1477) (770, 1209) (770, 1336) (770, 1477) (852, 1209) (852, 1336) (852, 1477) (697, 1633) (770, 1633) (852, 1633) (941, 1633) (941, 1209) (941, 1477)
Assuming an oscillator frequency fxtal = 3.58 MHz, the DTMF standard frequencies can be implemented as shown in Table 3. The relationship between telephone keyboard symbols and the frequency register contents are given in Table 4.
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
6.4 Modem frequencies Table 6
PCD3349A
Musical scale frequencies and their implementation HGF VALUE (HEX) F8 EA DD D0 C5 B9 AF A5 9C 93 8A 82 7B 74 6D 67 61 5C 56 51 4D 48 44 40 3D FREQUENCY (Hz) STANDARD(1) 622.3 659.3 698.5 740.0 784.0 830.6 880.0 923.3 987.8 1046.5 1108.7 1174.7 1244.5 1318.5 1396.9 1480.0 1568.0 1661.2 1760.0 1864.7 1975.5 2093.0 2217.5 2349.3 2489.0 GENERATED 622.5 659.5 697.9 741.1 782.1 832.3 879.3 931.9 985.0 1044.5 1111.7 1179.0 1245.1 1318.9 1402.1 1482.2 1572.0 1655.7 1768.5 1875.1 1970.0 2103.3 2223.3 2358.1 2470.4
Again assuming an oscillator frequency fxtal = 3.58 MHz, the standard modem frequency pairs summarized in Table 5 can be implemented. It is suggested to define the frequency by the HGF register while the LGF register contains 00H, disabling Low Group Frequency generation. Table 5 HGF VALU E (HEX) 9D 82 8F 79 80 45 76 48 5C 52 4B 44 Notes 1. Standard is V.21. 2. Standard is Bell 103. 3. Standard is Bell 202. 4. Standard is V.23. 6.5 Musical scale frequencies Standard modem frequency pairs and their implementation FREQUENCY (Hz) MODEM 980(1) 1180(1) 1070(2) 1270(2) 1200(3) 2200(3) 1300(4) 2100(4) 1650(1) 1850(1) 2025(2) 2225(2) GENERATED 978.82 1179.03 1073.33 1265.30 1197.17 2192.01 1296.94 2103.14 1655.66 1852.77 2021.20 2223.32 DEVIATION (%) (Hz)
NOTE D#5 E5 F5 F#5 G5 G#5 A5 A#5 B5 C6 C#6 D6 D#6 E6 F6 F#6 G6 G#6 A6 A#6 B6 C7 C#7 D7 D#7 Note
-0.12 -1.18 -0.08 -0.97 0.31 3.33 -0.37 -4.70 -0.24 -2.83 -0.36 -7.99 -0.24 -3.06 0.15 0.34 0.15 3.14 5.66 2.77
-0.19 -3.80 -0.08 -1.68
Finally, two octaves of musical scale in steps of semitones can be realized, again assuming an oscillator frequency fxtal = 3.58 MHz (Table 6). It is suggested to define the frequency by the HGF register while the LGF contains 00H, disabling Low Group Frequency generation.
1. Standard scale based on A4 at 440 Hz.
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
7 TIMING 10 IDLE MODE
PCD3349A
Although the PCD3349A operates over a clock frequency range from 1 to 16 MHz, fxtal = 3.58 MHz will usually be chosen to take full advantage of the frequency generator section. 8 RESET
In the Idle mode, the frequency generator remains operative. 11 INSTRUCTION SET RESTRICTIONS Since no serial I/O interface is provided, the serial I/O (Input/Output) instructions are not available. `MOV Dx, A' is the only applicable derivative instruction because the derivative registers are write-only. ROM space being restricted to 4 kbytes, SEL MB2/3 would define non-existing Program Memory banks and should therefore be avoided. RAM space being restricted to 224 bytes, care should be taken to avoid accesses to non-existing RAM locations.
In addition to the conditions given in the "PCD33xxA Family" data sheet, all derivative registers are cleared in the RESET state. 9 STOP MODE
Since the oscillator is switched off, the frequency generator receives no clock. It is suggested to clear both the HGF and LGF registers before entering Stop mode. This will cut-off the biasing of the internal amplifiers, considerably reducing current requirements. 12 SUMMARY OF MASK OPTIONS Table 7 Port mask options
PORT OUTPUT DRIVE(1) PORT NAME OPTION 1 Port 0 (P0.0 to P0.7) Port 1 (P1.0 to P1.7) Port 2 (P2.0 to P2.7) Notes 1. Port output drives: a) Option 1: standard I/O. b) Option 2: open-drain I/O. c) Option 3: push-pull output; see "PCD33xxA Family" data sheet. 2. Port state after reset: S = Set (HIGH) and R = Reset (LOW). Table 8 Mask options FEATURE ROM code: program/data Power-on-reset voltage level: VPOR Oscillator transconductance: gm X X X OPTION 2 X X X OPTION 3 X X X
PORT STATE AFTER RESET(2) SET X X X RESET X X X
DESCRIPTION Any mix of instructions and data up to ROM size of 4 kbytes. 1.2 to 3.6 V in increments of 100 mV; OFF LOW transconductance: gmL MEDIUM transconductance: gmM HIGH transconductance: gmH
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
13 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); see note 1 and 2. SYMBOL VDD VI II, IO Ptot PO ISS Tstg Tj Notes supply voltage all input voltages DC input or output current total power dissipation power dissipation per output ground supply current storage temperature operating junction temperature PARAMETER MIN. -0.5 -0.5 -10 - - -50 -65 -
PCD3349A
MAX. +7.0 +10 125 30 +50 +150 90 V VDD + 0.5 V
UNIT
mA mW mW mA C C
1. Stresses above those listed under Limiting Values may cause permanent damage to the device. 2. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. 14 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices (see "Handling MOS devices"). 15 DC CHARACTERISTICS VDD = 1.8 to 6 V; VSS = 0 V; Tamb = -25 to +70 C; all voltages with respect to VSS; fxtal = 3.58 MHz (gmL); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply (see Figs 5 to 9) VDD supply voltage operating; note 1 RAM data retention in Stop mode IDD operating supply current; note 2 VDD = 3 V; value HGF 0 and/or LGF 0 VDD = 3 V VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(idle) supply current Idle mode; note 2 VDD = 3 V; value HGF 0 and/or LGF 0 VDD = 3 V; value HGF = LGF = 0 VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(stp) supply current Stop mode VDD = 1.8 V; Tamb = 25 C; note 3 VDD = 1.8 V; Tamb = 70 C; note 3 1.8 1.0 - - - - - - - - - - - - - - 0.9 0.3 1.1 1.7 2.5 0.7 0.2 0.8 1.2 1.7 1.0 - 6 6 1.8 0.6 3.0 5.0 6.0 1.4 0.4 1.6 4.0 5.0 2.5 10 V V mA mA mA mA mA mA mA mA mA mA A A
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
PCD3349A
SYMBOL Inputs VIL VIH IIL IOL IOH IOH
PARAMETER
CONDITIONS
MIN. - -
TYP.
MAX.
UNIT
LOW-level input voltage HIGH-level input voltage input leakage current VSS VI VDD VDD = 3 V; VO = 0.4 V VO = 2.7 V; VDD = 3 V VO = 0 V; VDD = 3 V VDD = 3 V; VO = 2.6 V
0 -1
0.3VDD V VDD +1 - - -300 - V A
0.7VDD -
Port outputs (see Figs 10 to 12) LOW-level port sink current HIGH-level port pull-up source current HIGH-level port push-pull source current 0.7 -10 - -0.7 3.5 -20 -100 -4 mA A A mA
TONE output (see Fig.4; notes 1 and 4) VHGrms VLGrms f f VDC ZO VG THD VPOR HGF voltage (RMS) LGF voltage (RMS) frequency deviation DC voltage level output impedance pre-emphasis of group total harmonic distortion Tamb = 25 C; note 5 note 6 158 125 -0.6 - - 1.5 - -0.5 181 142 - 100 2.0 25 205 160 0.6 500 2.5 - mV mV % V dB dB
0.5VDD -
Power-on-reset Power-on-reset level variation around chosen VPOR 0 +0.5 V
Notes 1. TONE output requires VDD 2.5 V. 2. VIL = VSS; VIH = VDD; open-drain outputs connected to VSS; all other outputs open; value HGF = LGF = 0, unless otherwise specified. 3. Crystal connected between XTAL1 and XTAL2; pins T1 and CE/T0 at VSS; value HGF = LGF = 0. 4. Values are specified for DTMF frequencies only (CEPT). 5. Related to the Low Group Frequency (LGF) component (CEPT). 6. VPOR is an option chosen by the user. Depending on its value, it may restrict the supply voltage range.
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
PCD3349A
MGB826
handbook, halfpage
6
handbook, halfpage VDD
IDD(stp) (A) 5
4
DEVICE TYPE NUMBER (1)
TONE
1 F
3
50 pF
10 k
2
MGB835
VSS
1
0 1 3 5 VDD (V) 7
(1) Device type number: PCD3349A
Fig.5 Fig.4 TONE output test circuit.
Typical supply current (IDD) in Stop mode as a function of supply voltage (VDD).
handbook, halfpage
6
MGB827
handbook, halfpage
6
MGB828
IDD (mA) 16 MHz 4
IDD (mA) 4 5V 3.58 MHz HGF or LGF 0
2
10 MHz
2
3.58 MHz 0 1 3 5 VDD (V) 7 0 1
3V
10
fxtal (MHz)
10
2
Measured with crystal between XTAL1 and XTAL2.
Measured with function generator on XTAL1.
Fig.6
Typical operating supply current (IDD) as a function of supply voltage (VDD).
Fig.7
Typical operating supply current (IDD) as a function of clock frequency (fxtal).
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
PCD3349A
handbook, halfpage
6
MGB829
handbook, halfpage
6
MGB830
IDD(idle) (mA)
IDD(idle) (mA) 4 16 MHz 3.58 MHz HGF or LGF 0
4
2 10 MHz 3.58 MHz 0 1 3 5 VDD (V) 7
2
5V
3V 0 1 10 fxtal (MHz) 10
2
Measured with crystal between XTAL1 and XTAL2.
Measured with function generator on XTAL1.
Fig.8
Typical supply current (IDD) in Idle mode as a function of supply voltage (VDD).
Fig.9
Typical supply current (IDD) in Idle mode as a function of clock frequency (fxtal).
MGB831
handbook, halfpage
12
handbook, halfpage
-300
MBG095
IOL (mA) 8
IOH (A) -200
VO = V SS 4 -100
VO = 0.9VDD 0 1 3 5 VDD (V) 7 0 1 3 5 7
VDD (V)
VO = 0.4 V.
Fig.10 Typical LOW-level port output sink current (IOL) as a function of supply voltage (VDD).
Fig.11 Typical HIGH-level output pull-up source current (IOH) as a function of supply voltage (VDD).
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
PCD3349A
handbook, halfpage
-12
MGB833
MGD495
handbook, halfpage
6
IOH1 (mA) -8
VDD (V)
4
-4
VPOR = 2.0 V 2 VPOR = 1.3 V
0 1 3 5 VDD (V) 7
0 -25
25
75 125 Tamb (C) 70
VO = VDD - 0.4 V.
Fig.12 Typical HIGH-level push-pull output source current (IOH) as a function of supply voltage (VDD).
Fig.13 Typical Power-on-reset level (VPOR) as function of temperature.
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
PCD3349A
16 AC CHARACTERISTICS VDD = 1.8 to 6 V; VSS = 0 V; Tamb = -25 to +70 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL tr tf fxtal gmL gmM gmH RF PARAMETER rise time all outputs fall time all outputs clock frequency see Fig.14 CONDITIONS VDD = 5 V; Tamb = 25 C; CL = 50 pF MIN. - - 1 TYP. 30 30 - MAX. - - 16 UNIT ns ns MHz
Oscillator (see Fig.15) LOW transconductance MEDIUM transconductance HIGH transconductance feedback resistor VDD = 5 V 0.2 0.9 3.0 0.3 0.4 1.6 4.5 1.0 1.0 3.2 9.0 3.0 mS mS mS M
handbook, halfpage f
18 xtal (MHz) 15
MLA493
handbook, halfpage
10
MBG097
gmH gm (mS) gmM 1
12
9 guaranteed operating range
6
gmL
3
10
-1
0
1
3
5
1
3
5
VDD (V)
7
VDD (V)
7
Fig.14 Maximum clock frequency (fxtal) as a function of supply voltage (VDD).
Fig.15 Typical transconductance as a function of supply voltage (VDD).
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
17 PACKAGE OUTLINES
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
PCD3349A
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
ISSUE DATE 92-11-17 95-01-14
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
PCD3349A
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1998 May 11
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Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
18 SOLDERING 18.1 Introduction
PCD3349A
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). 18.2 18.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 18.3.2 WAVE SOLDERING
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 18.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 18.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 18.3 18.3.1 SO REFLOW SOLDERING
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
1998 May 11
18
Philips Semiconductors
Product specification
8-bit microcontroller with DTMF generator
19 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCD3349A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 20 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 May 11
19
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
415102/1200/05/pp20
Date of release: 1998 May 11
Document order number:
9397 750 03605

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